Our R&D Team
A full-spectrum R&D team with rich experience in optical, electronics, mechanical, software, testing, and manufacturing procedures.
We have developed, designed and manufactured high-speed optical transceivers that are cost effective and internationally competitive thanks to in-house technological innovations and technology partnerships.
In-house design intelligent optical transceiver functional testing system.
We continue to innovate new optoelectronic technology in the optical fiber communication industry.
Innovative COB Packaging Technologies
COB: Mature COB (chip on board) design and packaging technology is applied to the high-speed optical module to achieve superior optical performance indexes while ensuring high reliability and cost effective for data center demand.
Products: 100G QSFP28 LR4/CWDM4/PSM4/SR4 etc.
Innovative BOX Packaging Technologies
BOX: High-speed hermetic BOX packaging for high precision machining and Stable Gold Wire Bonding for AWG/TFF BOX Packaging. Parallel seam welding, nitrogen sealing and leak detection, the reliability is well guaranteed.
Products: 100G QSFP28 LR4/ER4-Lite/ER4/ZR4 etc.
Innovative Semiconductor Optical Amplifier (SOA) Technologies
SOA: ROSA with integrated SOA+ PIN PD module was miniaturized by optimizing the internal components. SOA amplification characteristics required for the long-distance transmission of 100GBASE.
Products: 100G QSFP28 ER4-Lite/ER4/ZR4 etc.
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